Global Semiconductor Forum 2006

Over 100 senior executives from the world’s leading semiconductor companies gathered for the 3rd annual Global Semiconductor Forum. Sponsored by Applied Materials, this invitation-only event attracted delegates from across the globe, including Asia, Europe and North America.

GSF 2006 provided delegates with an unrivalled opportunity to meet and network with suppliers showcasing their new products and technology as well as taking part in a wide variety of conference sessions.

The conference sessions covered a diverse range of topics and speakers, featuring:

• Jean-Francois Baril, VP procurement, Nokia
• Tim Ellis, senior consultant, FirstPartner
• Robert Jelski, sector head, semiconductors and advanced technologies, 3i
• Burn Lin, senior director, TSMC
• Jim Northup, COO, Toppan Photomasks
• Katsuhiro Shimohigashi, CEO, Starc Japan
• Peter Jenkins, VP of marketing, ASML
• Dan Heyler, first VP and head of Pacific Rim semiconductor research at Merrill Lynch

One of the most popular conference sessions was given by Jean-Francois Baril, VP of procurement at Nokia. His session, Mobile Technologies and Consumer Trends – Driving Semiconductor Demand, looked at procurement and supply chain issues. Mr Baril spoke about driving technology planning through developing a strong buyer / supplier relationship, which was ultimately driven by focusing on consumer insight and customer service.

Tim Ellis of FirstPartner sought to clarify what the future of the digital home might look like. Mr Ellis spoke about products being adopted by consumers via a need to ‘market a lifestyle’ in which products benefited the consumer rather than just ensuring the product features were accepted by the mass consumer market.

Robert Jelski of 3i talked about how new technologies and consumer demand impact the global semiconductor industry. Mr Jelski noted that technology was being driven by fashion trends, especially from the younger generations. This impacted the whole supply chain with speed to market a crucial factor. In terms of the semiconductor market the impact would ultimately lead to smaller geometries such as smaller wafer batches, product re-use and more design bundled into foundry services.

Dan Heyler of Merrill Lynch gave an overview on the semiconductor market in his global industry update presentation, whilst the workshop on optical lithography extensibility, chaired by Giang Dao, VP of Sematech, was very well received by the senior audience.

Other topics included presentations by Qualcomm, the Fab Owners Association, IBM, Starc and TSMC. By providing both the technical and the end-user experience, GSF 2006 is able to encompass the whole electronic supply chain right up to the end user manufacturers.

As well as the private meeting schedule and the conference sessions several of the delegates also took part in the 2nd annual GSF 2006 golf tournament, which was held the day before the main GSF 2006 event.

Pratheeva Kotalawela, GSF 2006 project director, said after this year’s event: “GSF 2006 proves once again that it is an invaluable experience for the entire semiconductor industry. Not only have delegates been able to preview new products and services, but everyone has had the chance to make new contacts and exchange ideas and information. They have also had the opportunity to hear insights into the future of the semiconductor sector from a variety of excellent speakers. The format is a
proven winner with nearly every supplier agreeing to return to the 2007 event which will be held in Hong Kong.”